Concurrent design and analysis of the Navigator wearable computer system: the thermal perspective
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/95/9755/00465154.pdf?arnumber=465154
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Prediction of electronic component-board transient conjugate heat transfer;IEEE Transactions on Components and Packaging Technologies;2005-12
2. Cooling of mobile electronic devices using phase change materials;Applied Thermal Engineering;2004-02
3. Bayesian surrogates for integrating numerical, analytical, and experimental data: application to inverse heat transfer in wearable computers;IEEE Transactions on Components and Packaging Technologies;2000-03
4. Thermal Management Strategies for Embedded Electronic Components of Wearable Computers;Journal of Electronic Packaging;1999-09-15
5. System level design as applied to CMU wearable computers;The Journal of VLSI Signal Processing;1999
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