Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
Author:
Affiliation:
1. Samsung Semiconductor Inc.,San Jose,USA
2. Samsung Electronics Co., Ltd.,Hwaseong-si,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565143.pdf?arnumber=10565143
Reference13 articles.
1. Heterogeneous Integration Platform for Next Generation Computing;Kang
2. 3D Microelectronic Packaging;Li,2021
3. Advanced package technologies for chiplet adoption and memory integration in HPC/AI applications;Li,2023
4. Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits
5. A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits;de Crécy;International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),2012
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