Fusing Current Characterization of Various Cu RDL Designs in Wafer Level Packages
Author:
Affiliation:
1. Amkor Technology Korea, Inc.,Research & Development,Incheon,Republic of Korea
2. Amkor Technology, Inc.,Research & Development,Phoenix,AZ,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565182.pdf?arnumber=10565182
Reference7 articles.
1. Advanced investigations on PCB traces fusing in high power applications
2. Fusing Current - When Traces Melt Without a Trace;Brooks;Printed Circuit Design, a Miller Freeman publication,1998
3. Fusing Currents in Traces;Brooks,2015
4. Analysis of Dispersive Characteristics and Structures of Copper Wire Melted by Overcurrent
5. II. On the heating effects of electric currents
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