Magnetic Cores for High Conversion Ratio Package Embedded Inductors
Author:
Affiliation:
1. Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA
2. The University of Tennessee, Knoxville,Department of Materials Science and Engineering,Knoxville,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564957.pdf?arnumber=10564957
Reference13 articles.
1. Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends
2. Two-Stage 48 V-12 V/6 V-1.8 V Voltage Regulator Module With Dynamic Bus Voltage Control for Light-Load Efficiency Improvement
3. Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V Integrated Voltage Regulators
4. Improving high frequency DC-DC converter performance with monolithic half bridge GaN ICs
5. Fully Integrated Voltage Regulators with Package-Embedded Inductors for Heterogeneous 3D-TSV-Stacked System-in-Package with 22nm CMOS Active Silicon Interposer Featuring Self-Trimmed, Digitally Controlled ON-Time Discontinuous Conduction Mode (DCM) Operation
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