Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration-Reference-Cited by-同舟云学术

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Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration

Published:2024-05-28 Issue: Volume: Page:2167-2171
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Shih Bo-Jheng¹,Pan Yu-Ming¹,Wang Chiao-Yen²,Chiu Huan-Yu²,Yang Chih-Chao³,Shen Chang-Hong³,Cheng Huang-Chung²,Chen Kuan-Neng²

Affiliation:

1. National Chiao Tung University,International College of Semiconductor Technology,Hsinchu,Taiwan,300

2. National Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan,300

3. Taiwan Semiconductor Research Institute,Hsinchu,Taiwan,300

Funder

Ministry of Education

National Science and Technology Council

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564972.pdf?arnumber=10564972

Reference17 articles.

1. New challenges and opportunities for 3D integrations

2. 3DVLSI with CoolCube process: An alternative path to scaling

3. Towards high density 3D interconnections

4. Monolithic 3-D Integration

5. Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

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