Development of Thick-Core Substrate Material for Cutting-Edge IC Packaging-Reference-Cited by-同舟云学术

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Development of Thick-Core Substrate Material for Cutting-Edge IC Packaging

Published:2024-05-28 Issue: Volume: Page:881-886
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Muguruma Tomo¹,Shin Tom¹,Honma Masafumi²,Saito Hirosuke³,Takahashi Genki³,Yasumoto Jun³,Washio Teppei⁴,Ishikawa Yuichi⁴,Tashiro Yutaka⁴,Okushima Yoshiki³,Biruni Ahammad Al³,Takahashi Ryuji⁴

Affiliation:

1. Sales Company of America,Panasonic Industrial Devices,Mountain View,CA,US

2. Materials (Suzhow) Co., Ltd.,Panasonic Industrial Devices,Suzhou,China

3. Panasonic Industry Co., Ltd.,Kadoma, Osaka,Japan

4. Panasonic Industry Co., Ltd.,Koriyama, Fukushima,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10564965.pdf?arnumber=10564965

Reference5 articles.

1. High-Density Fan-Out on Substrate Comes of Age;Jan Vardaman

2. CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference

3. Investigation of a Novel Substrate Core Material Designed to Reduce Package Warpage and Improve Assembly-Level Reliability

4. Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing

5. Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications

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