20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
Author:
Affiliation:
1. Delft University of Technology,Microelectronics, ECTM,Delft,The Netherlands
2. IMEC,Leuven,Belgium
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565284.pdf?arnumber=10565284
Reference6 articles.
1. Key metrics for the electromigration performance for solder and copper-based package interconnects
2. Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers
3. Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment
4. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
5. Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration
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