One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications-Reference-Cited by-同舟云学术

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One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications

Published:2024-05-28 Issue: Volume: Page:2003-2007
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Lin Zihao¹,Li Jiaxiong²,Sun Zhijian²,Fang Andrew D.³,Moon Kyoung-Sik²,Wong Ching-Ping²

Affiliation:

1. Georgia Institute of Technology,George W. Woodruff School of Mechanical Engineering,Atlanta,United States

2. Georgia Institute of Technology,School of Materials Science and Engineering,Atlanta,United States

3. Walton High School,Atlanta,United States

Funder

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565128.pdf?arnumber=10565128

Reference18 articles.

1. Flexible thermal interfacial materials with covalent bond connections for improving high thermal conductivity

2. Emerging challenges and materials for thermal management of electronics

3. Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

4. Materials for heterogeneous integration

5. Highly thermally conductive and mechanically strong graphene fibers

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