Thermomechanical analysis of Si-chip fracture caused by double-sided Ag sintering for PCB embedded package
Author:
Affiliation:
1. University of Applied Science,Electronics Integration Laboratory,Kempten,Germany
2. Electronics Integration Laboratory University of Applied Science,Kempten,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9894046/9894054/09894136.pdf?arnumber=9894136
Reference11 articles.
1. Simulation Based Design of Experiments of Power Cycling Tests using Die Top System Interconnect Technology Die Topy System (DTS(R));fabian;PCIM 2021,0
2. PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks;sharma;CIPS,2020
3. What is the Young's Modulus of Silicon?
4. Thermal stress and fracture in shear-constrained semiconductor device structures
5. Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications
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