Comparison of FEA Techniques for Estimation of Power Module Parasitics
Author:
Affiliation:
1. The University of Alabama,Department of Electrical and Computer Engineering,Tuscaloosa,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9894046/9894054/09894210.pdf?arnumber=9894210
Reference24 articles.
1. High temperature, wide bandgap full-bridge power modules for high frequency applications
2. Modeling of a Stacked Power Module for Parasitic Inductance Extraction;kaplan;Army Research Lab Adelphi,2017
3. Multibranch Inductance Extraction Procedure for Multichip Power Modules
4. Analyzing Electromagnetic Modes of Integrated Busbars implemented as Printed Circuit Boards (PCB);pokryvailo;2018 Proceedings of the 2018 COMSOL Conference,2018
5. Modeling and simulation of 2 kV 50 A SiC MOSFET/JBS power modules
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