Exploring the Photo-Electrochemical Processes of the Parallel Connected DSSCs in Indoor Conditions-Reference-Cited by-同舟云学术

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Exploring the Photo-Electrochemical Processes of the Parallel Connected DSSCs in Indoor Conditions

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Ursu Daniel¹,Vajda Melinda¹,Mareș Marius-Cristian²,Miclau Nicolae³,Miclau Marinela¹,Svasta Paul²

Affiliation:

1. National Institute of Research and Development for Electrochemistry and Condensed Matter,Department of Condensed Matter,Timisoara,Romania

2. “Politehnica” University of Bucharest,Centre for Technological Electronics and Interconnection Techniques,Bucharest,Romania

3. Politehnica University Timisoara,Department of Communications,Timisoara,Romania

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168443.pdf?arnumber=10168443

Reference20 articles.

1. Direct Contact of Selective Charge Extraction Layers Enables High-Efficiency Molecular Photovoltaics

2. A feasible scalable porphyrin dye for dye-sensitized solar cells under one sun and dim light environments

3. Fabrication of copper oxide-based dye-sensitized solar cell with high short-circuit current density (JSC) using flexible and binder-free porous photoelectrode

4. Highly efficient dye‐sensitized solar cells for wavelength‐selective greenhouse: A promising agrivoltaic system

5. Minimisation of the cost of generated electricity from dye-sensitised solar cells using numerical analysis

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1. Advancing dye-sensitized solar cell performance with bifacial illumination: A novel Stack Formation Framework approach;Optical Materials;2024-07

2. Enhanced Indoor Conversion Efficiency of Dye-Sensitized Solar Cells by Optimizing Ball-Milling Process of TiO2 Paste;Coatings;2024-02-26

3. Comparative Studies of Temperature Influence on Characteristics of Dye Sensitized and Silicon Based Solar Cells;2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME);2023-10-18

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