Diagnostics of a Future Blow Hole Issue Before Assembly-Reference-Cited by-同舟云学术

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Diagnostics of a Future Blow Hole Issue Before Assembly

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
language:
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Author:

Bušek David¹,Vondrouš Petr²,Mach Pavel¹,Dušek Karel¹

Affiliation:

1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology,Prague,Czech Republic

2. Czech Technical University in Prague,Faculty of Mechanical Engineering,Department of Manufacturing Technology,Prague,Czech Republic

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168342.pdf?arnumber=10168342

Reference15 articles.

1. Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating

2. Optimisation of the Plated Through Hole (PTH) Process Using Experimental Design and Response Surface Methodology

3. Detection of plated through hole defects in printed circuit board with X-ray

4. A New Method for Non-Destructive Characterization of Through Holes in Printed Circuit Boards

5. Blowholes in PCB Soldering Their Causes and Cures

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