Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
Author:
Affiliation:
1. Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen-Nürnberg,Bavaria,Germany
2. Digital Industries Process Automation, Siemens AG,Karlsruhe,Baden-Wuerttemberg,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168387.pdf?arnumber=10168387
Reference22 articles.
1. STENCIL PRINTING 008004/0201 APERTURE COMPONENTS;nauss;SMT Int,2019
2. Tiny Passive Chip 008004 and 5?m HD SMT Process Development (IMPACT 2018);chen;In 13th International Microsystems,2018
3. Inkjet Printing as a Key Enabling Technology for Printed Electronics;sridhar;Material Matters,2011
4. A review on inkjet printing of nanoparticle inks for flexible electronics
5. Fundamentals of Inkjet Printing
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1. Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Fine-Pitch Components;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
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