MR head wafer fabrication technology: current and future perspectives-Reference-Cited by-同舟云学术

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MR head wafer fabrication technology: current and future perspectives

Published:1996 Issue:1 Volume:32 Page:25-30
ISSN:0018-9464
Container-title:IEEE Transactions on Magnetics
language:
Short-container-title:IEEE Trans. Magn.

Author:

Baubock G.,Dang H.Q.,Hinson D.C.,Rea L.L.,Kim Y.K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx1/20/10172/00477545.pdf?arnumber=477545

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of Integrated GMR Sensor with Angular Variation;Advanced Materials Research;2013-02

2. Fabrication and Analysis of PM-biased Spin-valve Sensors;Journal of Physics: Conference Series;2011-01-01

3. Soft magnetic characteristics of an ultrathin CoFeNi free layer in spin-valve films;Journal of Magnetism and Magnetic Materials;2006-03

4. Skewed ion beam etching: a simple method to obtain a reduction in critical dimensions for magnetoelectronic sensors;Sensors and Actuators A: Physical;2004-07

5. Saturation magnetostriction of an ultrathin CoFe free-layer on double-layered underlayers;Journal of Applied Physics;2002-03

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