Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

Author:

Cook ChaseORCID,Sun Zeyu,Demircan Ertugrul,Shroff Mehul D.ORCID,Tan Sheldon X.-D.ORCID

Funder

NSF

DARPA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Cited by 37 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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4. A Graph-Learning-Driven Prediction Method for Combined Electromigration and Thermomigration Stress on Multi-Segment Interconnects;2024 Design, Automation & Test in Europe Conference & Exhibition (DATE);2024-03-25

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