Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method
Author:
Funder
NSF
DARPA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
https://ieeexplore.ieee.org/ielaam/92/8345376/8301538-aam.pdf
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