An electromigration and thermal model of power wires for a priori high-level reliability prediction-Reference-Cited by-同舟云学术

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An electromigration and thermal model of power wires for a priori high-level reliability prediction

Published:2004-04 Issue:4 Volume:12 Page:349-358
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Casu M.R.,Graziano M.,Masera G.,Piccinini G.,Zamboni M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx5/92/28716/01288170.pdf?arnumber=1288170

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