Design and Optimization of Inductive-Coupling Links for 3-D-ICs-Reference-Cited by-同舟云学术

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Design and Optimization of Inductive-Coupling Links for 3-D-ICs

Published:2019-03 Issue:3 Volume:27 Page:711-723
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Fletcher Benjamin J.^ORCID,Das Shidhartha,Mak Terrence

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/8649697/08561260.pdf?arnumber=8561260

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Multi-Layer Stacked 3-D SRAM System Based on Wireless Transceiver using Inductively Coupled Interface in 22-NM CMOS;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

2. Analysis of on‐chip GSG pads coupling effects on laterally‐coupled and double‐stacked inductors in the millimeter‐wave frequency regime;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2023-04-07

3. Internet of Things World: A New Security Perspective;SN Computer Science;2022-11-01

4. Flexible design method for multiple loads inductive power transfer system with equal power distribution;International Journal of Circuit Theory and Applications;2022-07-21

5. Design of a Transmitter for Inductively-Coupled High-Bitrate Communication in Stacked Chips;IEEE Transactions on Circuits and Systems II: Express Briefs;2021-11

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