Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes-Reference-Cited by-同舟云学术

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Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes

Published:2022-01 Issue:1 Volume:30 Page:60-67
ISSN:1063-8210
Container-title:IEEE Transactions on Very Large Scale Integration (VLSI) Systems
language:
Short-container-title:IEEE Trans. VLSI Syst.

Author:

Lanzillo Nicholas A.^ORCID,Chu Albert,Bhosale Prasad,Dechene Dan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/92/9686552/09619766.pdf?arnumber=9619766

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Benchmarking Power Delivery Network Designs at the 5-nm Technology Node;IEEE Transactions on Electron Devices;2022-12

5. Tailoring skyrmion motion dynamics via magnetoelectric coupling: Toward highly energy-efficient and reliable non-volatile memory applications;Journal of Applied Physics;2022-08-28

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