Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board-Reference-Cited by-同舟云学术

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Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board

Published:2023-06-28 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM)
language:
Short-container-title:

Author:

Hsieh I-Wen¹,Chen Yu-Chi¹,Hung Shao-Kang¹

Affiliation:

1. National Yang Ming Chiao Tung University,Dept. of Mechanical Engineering,Hsinchu City,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10196083/10196094/10196200.pdf?arnumber=10196200

Reference14 articles.

1. 24-Bit Analog-to-Digital Converter (ADC) for Weigh Scales;semiconductor,0

2. PCB Manufacturing Process – A Step by-Step Guide,0

3. An Introduction to Measurements using Strain Gauges;hoffmann;Hottinger Baldwin Messtechnik GmbH Darmstadt,1989

4. A Comprehensive Study of an Aluminum Alloy AL-5052;bhowmik;Advance Physics Letter,2016

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