Complexity Coping by Methodical Agile and Modular Product Development - A Bibliometric Review-Reference-Cited by-同舟云学术

Complexity Coping by Methodical Agile and Modular Product Development - A Bibliometric Review

Published:2023-12-18 Issue: Volume:33 Page:1394-1400
ISSN:
Container-title:2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)
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Author:

Zuefle M.¹,Rennpferdt C.¹,Batora M.²,Bursac N.²,Krause D.¹

Affiliation:

1. Hamburg University of Technology, Institute of Product Development and Mechanical Engineering Design,Germany

2. Hamburg University of Technology, Institute of Smart Engineering and Machine Elements,Hamburg,Germany

Publisher

IEEE

Link

Reference29 articles.

3. ASSESSMENT OF NEW TECHNOLOGIES IN A MULTI-DISCIPLINARY DESIGN ANALYSIS AND OPTIMIZATION ENVIRONMENT INCLUDING RAMS AND COST DISCIPLINES;Cabaleiro

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