[Front cover]
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Instrumentation
Link
http://xplorestaging.ieee.org/ielx5/7361/4305206/04384691.pdf?arnumber=4384691
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Cross-section analysis of the morphology of electrodeposited copper obtained in the hydrogen co-deposition range;Journal of the Serbian Chemical Society;2009
2. The ionic equilibrium in the CuSO4-H2SO4-H2O system and the formation of the honeycomb-like structure during copper electrodeposition;Journal of the Serbian Chemical Society;2008
3. Effect of temperature on the electrodeposition of disperse copper deposits;Journal of the Serbian Chemical Society;2007
4. The effects of a magnetic field on the morphologies of nickel and copper deposits: The concept of "effective overpotential";Journal of the Serbian Chemical Society;2007
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