Pushing the Envelope for Heterogeneity: Multilayer and 3-D Heterogeneous Integrations for Next Generation Millimeter- and Submillimeter-Wave Circuits and Systems
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/6668/7843705/07843744.pdf?arnumber=7843744
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