Thermal Management of GaN Power Modules Using Copper Core PCBs with Direct Heatsink Pads
Author:
Affiliation:
1. The Edward S. Rogers Sr., University of Toronto,Department of Electrical and Computer Engineering
2. Southeast University,Jiangsu,Nanjing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10399638/10399484/10399745.pdf?arnumber=10399745
Reference5 articles.
1. Thermal management for GaN power devices mounted on PCB substrates
2. Copper-Core MCPCB With Thermal Vias for High-Power COB LED Modules
3. IEEE Power Electronics Society, and IEEE Industry Applications Society
4. Power Sources Manufacturers Association, and Institute of Electrical and Electronics Engineers
5. Integral 3-D Thermal, Electrical and Mechanical Design of an Automotive DC/DC Converter
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