Passive Multiport RC Model Extraction for Through Silicon Via Interconnects in 3-D ICs-Reference-Cited by-同舟云学术

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Passive Multiport RC Model Extraction for Through Silicon Via Interconnects in 3-D ICs

Published:2014-06 Issue:3 Volume:56 Page:646-652
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Engin A. Ege

Funder

U.S. Air Force Research Laboratory/Information Directorate, Rome, NY

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/15/6819486/06719510.pdf?arnumber=6719510

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Passive Modeling of Interconnects Using Sum of Squares Partial Fraction Expansions;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12

2. Sum of Squares Partial Fractions: Application in Modeling of Interconnects in Heterogeneous Integration;2022 IEEE CPMT Symposium Japan (ICSJ);2022-11-09

3. Passive Scalar Function Approximation Using SOS Polynomials;IEEE Transactions on Electromagnetic Compatibility;2022-06

4. Passive Modeling of One-Port Networks Through SOS Orthogonal Rational Functions;2022 IEEE 26th Workshop on Signal and Power Integrity (SPI);2022-05-22

5. AAA Algorithm for Rational Transfer Function Approximation With Stable Poles;IEEE Letters on Electromagnetic Compatibility Practice and Applications;2021-09

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