Study of isotropically conductive bondings filled with aggregates of nano-sited Ag-particles-Reference-Cited by-同舟云学术

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Study of isotropically conductive bondings filled with aggregates of nano-sited Ag-particles

Published:1997-03 Issue:1 Volume:20 Page:15-20
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Kotthaus S.¹,Gunther B.H.,Hang R.,Schafer H.

Affiliation:

1. Robert Bosch GmbH, Stuttgart, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/12176/00558539.pdf?arnumber=558539

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