Approach to Simplify the Development of IoT Systems that Interconnect Embedded Devices Using a Single Program
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Published:2023
Issue:2
Volume:77
Page:2463-2480
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ISSN:1546-2226
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Container-title:Computers, Materials & Continua
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language:en
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Short-container-title:CMC
Author:
Blanco Enol Matilla,Espada Jordán Pascual,Crespo Rubén Gonzalez
Publisher
Computers, Materials and Continua (Tech Science Press)
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Modeling and Simulation,Biomaterials