Author:
Song Wei,Wang Haolin,Zhang Xinping,Xia Jianxin,Liu Tongmu,Shi Yuxi
Publisher
Computers, Materials and Continua (Tech Science Press)
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Modeling and Simulation,Biomaterials
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献