New Reconfigurable Fiber–Chip Coupling Method for Multipurpose Packaging with up to 50 GHz Modulation Bandwidth-Reference-Cited by-同舟云学术

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New Reconfigurable Fiber–Chip Coupling Method for Multipurpose Packaging with up to 50 GHz Modulation Bandwidth

Published:2000-01 Issue:1 Volume:6 Page:68-73
ISSN:1068-5200
Container-title:Optical Fiber Technology
language:en
Short-container-title:Optical Fiber Technology

Author:

Fischer U.H.P.,Peters K.,Ziegler R.,Pech D.,Kilk A.,Eckhardt Th.,Mekonnen G.G.,Jacumeit G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Atomic and Molecular Physics, and Optics,Instrumentation,Control and Systems Engineering

Reference10 articles.

1. Laser micro welding am micro melting for connection of optoelectronic micro-components;Becker,1994

2. Optical components—the new challenge in packaging;Mathews;IEEE Trans. Components, Hybrids and Manufac. Technol.,1990

3. Trends in Laserpackaging;Alles,1990

4. Micropackaging technologies for optoelectronic components;Hall,1997

5. An automated fiber alignment, fixing and hermetic sealing system;Bargar,1988

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RF Lines;Photonic Packaging Sourcebook;2015

2. Combined nano-imprint and photolithography (CNP) of integrated polymer optics;SPIE Proceedings;2007-02-08

3. Lab-on-a-chip with integrated optical transducers;Lab Chip;2006

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