VIBRATION PROTECTION OF CRITICAL COMPONENTS OF ELECTRONIC EQUIPMENT IN HARSH ENVIRONMENTAL CONDITIONS

Author:

VEPRIK A.M.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Acoustics and Ultrasonics,Condensed Matter Physics

Reference24 articles.

1. Design and Packaging of Electronic Equipment;SLOAN,1985

2. Vibration Analysis for Electronic Equipment;STEINBERG,1988

3. Packaging of Electronic Systems (A mechanical Engineering Approach);DALLY,1990

4. Thales Computers, 1997, The Ruggedizer White Paper, http://www.cetia.com/product/prod_rug.htm

5. Dy4 Systems Inc. 2001, Ruggedization Levels, http://www.dy4.com/dy4/experience/rugglevels.htm

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