Interfacial Characteristics and Fracture Toughness of Electrolytically Ni-Plated Carbon Fiber-Reinforced Phenolic Resin Matrix Composites
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Chemical interactions at the interface between a carbon fiber and a boron trifluoride-catalyzed epoxy matrix
2. Studies on the Surface Free Energy of Carbon–Carbon Composites: Effect of Filler Addition on the ILSS of Composites
3. Carbon Fibers.;Donnet,1990
4. Nitric acid oxidation of carbon fibers and the effects of subsequent treatment in refluxing aqueous NaOH
5. Anodic surface oxidation for pitch-based carbon fibers and the interfacial bond strengths in epoxy matrices
Cited by 84 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Enhancement of interfacial performance of carbon fiber reinforced polypropylene composites by dual action of polyetherimide nanoparticles and coatings;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-05
2. Effect of Ni coating thickness on microstructure and properties of CF/Al composites prepared by vacuum pressure infiltration process;Vacuum;2024-04
3. A review on failure mechanism and mechanical performance improvement of FRP-metal adhesive joints under different temperature-humidity;Thin-Walled Structures;2023-07
4. Hybrid Metal-Organic Frameworks/Carbon Fibers Reinforcements for Additively Manufactured Composites;Nanomaterials;2023-03-05
5. Synthesis, surface modifications, and biomedical applications of carbon nanofibers: Electrospun vs vapor-grown carbon nanofibers;Coordination Chemistry Reviews;2022-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3