Author:
Kim Woojo,Kwon Jimin,Jung Sungjune
Abstract
Printing technologies have received a lot of attention and expectations for
producing flexible and wearable electronics. However, the low transistor density
of the printed devices has been a major obstacle to commercialization. In this
review, a three-dimensional (3D) integration of organic flexible and printed
electronics is described. First, layout-to-bitmap conversion and design rules
for printed transistors, arrays, and integrated circuits are introduced. Then,
printed 3D transistors, digital integrated circuits, and memories are described.
Finally, 3D integration of printed active-matrix arrays and sensors is
highlighted. This approach is a breakthrough technology that not only reduces
the area occupied by a single transistor, memory, and sensor, but also increases
the efficiency of routing, effectively reducing the area of the entire devices.
In addition, monolithic 3D integration through the printing can stack
transistor, memory, and sensor by simply repeating the additive process.
Funder
Korea Innovation Foundation
National Research Foundation of Korea
Publisher
Korea Flexible & Printed Electronics Society