Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns-Reference-Cited by-同舟云学术

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Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

Published:2016-08-31 Issue:8 Volume:26 Page:427-429
ISSN:1225-0562
Container-title:Korean Journal of Materials Research
language:
Short-container-title:Korean. J. Mater. Res.

Author:

Lee Woojin, ,Kim Tae Hyung,Choa Yong-Ho

Funder

Ministry of Trade, Industry and Energy

Publisher

The Materials Research Society of Korea

Subject

General Materials Science

Link

http://ocean.kisti.re.kr/downfile/crosscheck/mrsk/JAKO201625654348162.pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Solvent‐Free, Thermally Curable Low‐Temperature Organic Planarization Layer for Thin Film Encapsulation;Small;2022-12-21

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