Effect of Saw-Damage Etching Conditions on Flexural Strength in Si Wafers for Silicon Solar Cells-Reference-Cited by-同舟云学术

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Effect of Saw-Damage Etching Conditions on Flexural Strength in Si Wafers for Silicon Solar Cells

Published:2010-11-27 Issue:11 Volume:20 Page:617-622
ISSN:1225-0562
Container-title:Korean Journal of Materials Research
language:en
Short-container-title:Korean Journal of Materials Research

Author:

Kang Byung-Jun,Park Sung-Eun,Lee Seung-Hun,Kim Hyun-Ho,Shin Bong-Gul,Kwon Soon-Woo,Byeon Jai-Won,Yoon Se-Wang,Kim Dong-Hwan

Publisher

The Materials Research Society of Korea

Subject

General Materials Science

Link

http://ocean.kisti.re.kr/downfile/crosscheck/mrsk/JAKO201001039068812.pdf

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Proton Irradiated Effect on n, p type Silicon by Positron Annihilation Method;Journal of the Korean Vacuum Society;2012-09-30

2. Proton Irradiated Cz-Si by the Coincidence Doppler Broadening Positron Annihilation Spectroscopy;Journal of the Korean Vacuum Society;2011-09-30

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