Porous Code: Proposal for Inconspicuous Universal 2D Code with Reduced Hole Machining Area Ratio-Reference-Cited by-同舟云学术

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Porous Code: Proposal for Inconspicuous Universal 2D Code with Reduced Hole Machining Area Ratio

Published:2024-09-01 Issue:5 Volume:28 Page:233-247
ISSN:1342-6230
Container-title:Journal of Signal Processing
language:en
Short-container-title:Journal of Signal Processing

Author:

Kimura Kentaro¹,Kuragasaki Toshiki²,Douseki Takakuni²,Fukumizu Yohei²

Affiliation:

1. VLSI Center, Ritsumeikan University

2. Faculty of Science and Engineering, Ritsumeikan University

Publisher

Research Institute of Signal Processing, Japan

Link

https://www.jstage.jst.go.jp/article/jsp/28/5/28_233/_pdf

Reference14 articles.

1. [1] 原昌宏, 渡部元秋, 野尻忠雄, 長屋隆之, 内山祐司：二次元コード, 特許2938338 号, 1999.

2. [2] D. G. Priddy and R. S. Cymbalski: Dynamically variable machine readable binary code and method for reading and producing thereof, US Patent 4939354, 1990.

3. [3] R. Stevenson: Laser marking matrix codes on PCBs, M. Printed Circuit Design and Manufacture, No. 12, pp. 32-36, 2005.

4. [4] V. Stefan: The use of 2D codes in the development of mobile applications with database, Valahian Journal of Economic Studies, Vol.3 No.2, pp. 105-114, 2012.

5. [5] 【熱転写】ラベルの使用環境に合った素材＆インクリボンの選び方, ブラザー工業株式会社: https://www.brother.co.jp/product/biz/business-navi/column/other/use4/index.aspx.

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