深低温大功率电阻阵列封装结构研究-Reference-Cited by-同舟云学术

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深低温大功率电阻阵列封装结构研究

Published:2022 Issue:8 Volume:51 Page:20210721
ISSN:1007-2276
Container-title:Infrared and Laser Engineering
language:en
Short-container-title:红外与激光工程

Author:

Sun Quan 孙权,Mo Defeng 莫德锋,Liu Dafu 刘大福,Gong Haimei 龚海梅

Publisher

Shanghai Institute of Optics and Fine Mechanics

Subject

Electrical and Electronic Engineering,Space and Planetary Science,Aerospace Engineering,Atomic and Molecular Physics, and Optics

Reference17 articles.

1. Infrared scene generation technology based on hardware-in-the-loop simulation of MOS resistance arrays;Journal of System Simulation,2018

2. Development analysis of foreign tactical missile hardware-in-the-loop simulation capability;W H Kong;Tactical Missile Technology,2020

3. Status and development analysis of hardware-in-the-loop simulation technologies for the aircraft;Journal of System Simulation,2019

4. Research on dual-band infrared image generation technology based on MOS resistor array;Air & Space Defense,2020

5. Research on a pulse tube cooler for resistor array cooling;Cryogenics,2015

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 40 K双波段长波探测器冷箱封装技术研究;Infrared and Laser Engineering;2024

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