Author:
LEI Jingfa 雷经发,SUN Yin 孙寅,ZHANG Miao 张淼,LI Yongling 李永玲,ZHAO Ruhai 赵汝海,SUN Hong 孙虹
Publisher
Shanghai Institute of Optics and Fine Mechanics
Cited by
1 articles.
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1. 一种基于条纹相位特征的印刷电路板三维重建方法;Acta Optica Sinica;2024