Ultrasonic assisted grinding for silicon carbide-Reference-Cited by-同舟云学术

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Ultrasonic assisted grinding for silicon carbide

Published:2015 Issue:8 Volume:23 Page:2229-2235
ISSN:1004-924X
Container-title:Optics and Precision Engineering
language:en
Short-container-title:光学精密工程

Author:

LIU Li-fei 刘立飞,ZHANG Fei-hu 张飞虎,LIU Min-hui 刘民慧

Publisher

Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences

Subject

Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Vibration Direction on Vibration-Assisted Fixed Abrasive Polishing;Mechanics;2024-02-23

2. Simulation experimental investigations into material removal mechanism of SiC ceramic by using drilling-grinding composite machining;The International Journal of Advanced Manufacturing Technology;2023-10-14

3. Simulation experimental investigations into material removal mechanism of SiC ceramic by using drilling-grinding composite machining;2023-09-19

4. Design of composite abrasives and substrate materials for chemical mechanical polishing applications;Applied Nanoscience;2019-11-07

5. Experimental evaluation of surface topographies of NMQL grinding ZrO2 ceramics combining multiangle ultrasonic vibration;The International Journal of Advanced Manufacturing Technology;2018-09-25

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