Affiliation:
1. Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, USA
Abstract
Transferred-substrate heterojunction bipolar transistors (HBTs) have demonstrated very high bandwidths and are potential candidates for very high speed integrated circuit (IC) applications. The transferred-substrate process permits fabrication of narrow and aligned emitter-base and collector-base junctions, reducing the collector-base capacitance and increasing the device f max . Unlike conventional double-mesa HBTs, transferred-substrate HBTs can be scaled to submicron dimensions with a consequent increase in bandwidth. This paper introduces the concept of transferred-substrate HBTs. Fabrication process in the AlInAs/GaInAs material system is presented, followed by DC and RF performance. A demonstration IC is shown along with some integrated circuits in development.
Publisher
World Scientific Pub Co Pte Lt
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Ultra high-speed InP/InGaAs DHBTs withftof 203 GHz;Journal of Semiconductors;2009-01
2. HIGH SPEED CIRCUITS FOR LIGHTWAVE COMMUNICATIONS;International Journal of High Speed Electronics and Systems;1998-06