COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS

Author:

LI MINGGANG1,WEI GUOYING1,WANG JIANFANG1,LI MENG1,ZHAO XIXI1,BAI YUZE2

Affiliation:

1. College of Materials Science and Engineering, China Jiliang University, Hang Zhou 310018, P. R. China

2. Environmental Monitoring Station of Yangquan, Shanxi Province, P. R. China

Abstract

Non-cyanide alkaline bath was used to prepare copper thin films. Influences of various temperatures on deposition rates, surface morphologies and microstructures of films were investigated. Copper thin films prepared from non-cyanide alkaline bath show typical nodular structures. Copper films fabricated at higher temperature possess rough surface due to hydrolysis of complexing agents. According to the XRD patterns, all deposited films were crystalline and showed Cu (111), Cu (200) and Cu (220) peaks. The intensity of peak (200) increases gradually with the rise on bath temperatures. Films with maximum thickness (7.5 μm) could be obtained at the temperature of 40°C. From the cyclic voltammetry curve, it was found that the cathodic polarization decreased slightly with increase of bath temperatures. In addition, when the bath temperature was equal to 50°C, current efficiency could reach to 96.95%.

Publisher

World Scientific Pub Co Pte Lt

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Reference12 articles.

1. M. Schlesinger and M. Paunovic, Modern Electroplating, 4th edn. (Wiley, New York) p. 63.

2. ELECTRODEPOSITION OF CoAg FILMS FROM EMIC IONIC LIQUID

3. Nucleation and Growth of Copper on TiN from Pyrophosphate Solution

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