Study of the Interface Characteristic of Be/HR-1 Stainless Steel Following Diffusion Bonding
Author:
Affiliation:
1. China Academy of Engineering Physics, Box 919-71, Mianyang, Sichuan, 621900, China
2. Materials Institute, Chongqing University, Chongqing, 400044, China
Abstract
Publisher
World Scientific Pub Co Pte Lt
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Link
https://www.worldscientific.com/doi/pdf/10.1142/S0218625X03004858
Reference9 articles.
1. Development of joining technology for Be/Cu-alloy and Be/SS by HIP
2. Technologies of Joining between ITER Reference Grade Beryllium and Copper Alloys by Diffusion Bonding Process
3. Isostatic diffusion bonding of microduplex stainless steel
4. HIP'ing of copper alloys to stainless steel
5. A review of the US joining technologies for plasma facing components in the ITER fusion reactor
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