Affiliation:
1. School of Mechanical Engineering, Kalinga Institute of Industrial Technology, Bhubaneswar, Odisha, India
2. Department of Mechanical and Industrial Engineering, Indian Institute of Technology, Roorkee, India
Abstract
In this paper, the machinability aspects of Ti-5553 have been experimentally investigated during Electro-Discharge Machining using three different geometrical shapes of copper electrodes i.e. cylindrical, triangular, and square. TIMETAL (Ti-5553) is a titanium-based alloy extensively used for special aerospace and marine applications due to its high strength and higher hardenability. By changing each of the aforementioned process parameters at three distinct levels, experiments based on the L[Formula: see text] orthogonal array (OA) design of the experiment (DOE) were carried out. The machining performance has been carried out by utilizing different input parameters i.e. current, pulse off time ([Formula: see text]), flushing pressure ([Formula: see text]), tool shape ([Formula: see text]), and voltage (V) to examine machining performance characteristics like material removal rate (MRR), tool wear rate (TWR), surface roughness (Ra), white layer thickness (WLT), and surface crack density (SCD). Surface integrity in contents of surface morphology and surface topography is discussed herein. In this MRR, TWR, and Ra have been optimized by using a methodology (combining Grey relational analysis method and Taguchi’s philosophy) and found the optimal parameters that will have more MRR and less TWR, Ra. Later SCD and WLT were investigated by employing the optimal setting (A3, B2, C2, D2, E1, F3) and arbitrary setting (A3, B2, C1, D3, E3, F2) and concluded that SCD and WLT are less by utilizing optimal settings for machining as compared to arbitrary settings. Among all three different geometrical shapes of copper electrodes, the cylindrical tool has been found to be the best suitable tool for machine Ti-5553.
Publisher
World Scientific Pub Co Pte Ltd
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics