Affiliation:
1. Physics Department, LESIMS, University of Annaba, BP 12 Annaba, Algeria
Abstract
The growth kinetics of the solid solution phase of aluminum in copper in diffusion couples of pure aluminum and copper has been investigated at 425°C using a scanning electron microscope. In the initial stage, the phase layer growth was found to obey the parabolic law, indicating that the rate-controlling process is diffusion. At longer times, the growth rate deviates from the kt-1/2 behavior of the early stage.
Publisher
World Scientific Pub Co Pte Lt
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
2 articles.
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