A SiGe HBT IC CHIPSET for40-Gb/s OPTICAL TRANSMISSION SYSTEMS

Author:

MASUDA T.1,SHIRAMIZU N.1,OHUE E.1,ODA K.1,HAYAMI R.1,KONDO M.1,ONAI T.1,WASHIO K.1,OHHATA K.2,ARAKAWA F.2,TANABE M.2,SHIMAMOTO H.2,HARADA T.3

Affiliation:

1. ULSI Research Department, Central Research Laboratory, Hitachi, Ltd., 1-280 Higashi-koigakubo, Kokubunji, Tokyo 185-8601, Japan

2. Musashino Office, Hitachi Device Engineering, Co. Ltd., 1-280 Higashi-koigakubo, Kokubunji, Tokyo 185-8601, Japan

3. Device Development Center, Hitachi, Ltd., 6-16-3 Shin-machi, Ome, Tokyo, 198-8512, Japan

Abstract

Using a 0.2-μm self-aligned epitaxial-growth silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) technology, we have developed a chipset for 40-Gb/s time-division multiplexing optical transmission systems. In this paper, we describe seven analog and digital ICs: a 45-GHz bandwidth transimpedance amplifier, a 48.7-GHz bandwidth automatic-gain-controllable amplifier, a 40-Gb/s decision circuit, a 40-Gb/s full-wave rectifier, a 40-Gb/s limiting amplifier with a 32-dB gain, a 45-Gb/s 1:4 demultiplexer, and a 45-Gb/s 4:1 multiplexer. To increase bandwidth of the transimpedance amplifier, a common-base input stage is introduced. In order to have high gain and wide bandwidth simultaneously, active load circuits composed of a differential transimpedance amplifier are used for the AGC amplifier, the limiting amplifier, and the decision circuit. Full-rate clocking is employed to reduce the influence caused by clock-duty variation in digital circuits such as the decision circuit, the demultiplexer, and the multiplexer. All ICs were characterized by using on-wafer probes, and some of them were built in brass-packages for bit-error rate measurement.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electronic, Optical and Magnetic Materials

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