AUTOMATIC COLLISION DETECTION FOR ASSEMBLY SEQUENCE PLANNING USING A THREE-DIMENSIONAL SOLID MODEL

Author:

ALFADHLANI 1,SAMADHI T. M. A. ARI2,MA'RUF ANAS2,TOHA ISA SETIASYAH2

Affiliation:

1. Industrial Engineering Department, Andalas University, Limau Manis, Padang, 25163, Indonesia

2. Industrial Engineering Department, Bandung Institute of Technology, Jl. Ganesha 10, Bandung, 40132, Indonesia

Abstract

Assembly sequence planning of a product involves several steps, including generation of precedence constraints, generation of assembly sequences, and selection of assembly sequences. Generation and selection of assembly sequences should be able to guarantee the feasibility of assembly. Assembly will be feasible if there is no collision between components when assembled. Detection of collision-free path of assembly can be done in an automated way. There are a number of collision detection methods that have been developed, but the method requires a complicated process of data geometry analysis. This paper proposes a method for detecting a collision-free path of the assembly component in a more simple way. Geometrical data required, taken from the three-dimensional (3D) solid drawing in the form of stacked drawing in computer-aided design (CAD) systems. Retrieval of geometrical data of components and detection of the collision-free path of an assembly were done in an automated way, directly from the CAD system.

Publisher

World Scientific Pub Co Pte Lt

Subject

Industrial and Manufacturing Engineering,Strategy and Management,Computer Science Applications

Reference12 articles.

1. Product design for manufacture and assembly

2. E. Kroll, Concurrent Engineering: Automation, Tools, and Techniques, ed. A. Kusiak (1992) pp. 177–205.

3. A systematic approach for automatic assembly sequence plan generation

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Reinforcement learning for disassembly sequence planning optimization;Computers in Industry;2023-10

2. Decreasing Number of Geometric Feasibility Checks in Automatic Assembly Planning: A Review;2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM);2023-06-29

3. Image-assisted collision detection for calculation of an assembly interference matrix;The International Journal of Advanced Manufacturing Technology;2023-04-10

4. The 3D Product Model Research Evolution and Future Trends: A Systematic Literature Review;Applied System Innovation;2022-02-22

5. Development of a Visual Assembly Planning System based on Neutral Files;Procedia CIRP;2022

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3