Quantitative Detection of Trace Copper by Using Graphene Oxide and X-Ray Fluorescence Spectroscopy

Author:

Liu Jia-Hui1,Zhu Junhao2,Wang Na2,He Fei2,He Luanying2,Song Haihong2,Dong Yiyang2,Zhang Li1,Wang Shihui2

Affiliation:

1. Analytical Instrumentation Center, College of Chemistry and Molecular Engineering, Peking University, Beijing 100871, China

2. College of Life Science and Technology, Beijing University of Chemical Technology, Beijing 100029, China

Abstract

The X-ray fluorescence spectroscopy (XRF) has been widely applied on the analysis of elements. The traditional sample preparation needs a large sample weight and high temperature/pressure. To overcome these drawbacks, we used graphene oxide (GO) as a matrix for the carry of trace metal (copper was used as a model) and constructed a sandwich-layered GO which carried trace copper nanomembrane (SL-GO-Cu). After the optimization of filter membranes, nanomembrane composition and GO content in the bottom layer of SL-GO-Cu, the limit of detection (LOD) of SL-GO-Cu achieves 2.99 [Formula: see text]g/g. The LOD is ca. 1/3 or 1/1923 of the traditional melt pellets of trace CuO (MPT-Cu) and tabletting pellets of trace CuO (TPT-Cu) methods, respectively. The SL-GO-Cu is independent of CuO size, but varies with different Cu compounds. Recoveries of all the SL-GO-Cu samples prepared above are higher than 94% and do not show significant difference. In summary, the SL-GO-Cu is a promising method for the efficient and economical determination of trace elements.

Funder

National Key Research and Development Project

Science and Technology Planning Project of Shenzhen Municipality

Innovative Research Group Project of the National Natural Science Foundation of China

National Natural Science Foundation of China

Publisher

World Scientific Pub Co Pte Lt

Subject

Condensed Matter Physics,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Advances in Techniques for Copper Analysis in Aqueous Systems;Various Uses of Copper Material [Working Title];2023-11-23

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