INTERCONNECT MODELING WITH THE EXISTENCE OF LINE INDUCTANCE

Author:

EL-MOURSY MAGDY A.12,SHAWKEY HEBA A.12

Affiliation:

1. Mentor Graphics Corporation, Cairo, Egypt

2. Microelectronics Department, Electronics Research Institute, Cairo, Egypt

Abstract

Simple uniform reduced order model is used to model RLC interconnect lines. Waveform characterization is used to evaluate the accuracy of the adopted model. Few number of sections are shown to achieve high accuracy of modeling the RLC interconnect. As compared to RC lines, less than five times the number of sections is sufficient to model RLC lines. The model is shown to be accurate for wide range of relative impedance of the driver, the line, and the load. Look-up tables are provided to simplify the process of choosing the best interconnect section model to characterize an RLC interconnect line. The tables are shown to be accurate for wide range of relative impedance. The presented model reduces the simulation time while keeping the simulation accuracy. The simulation time can be reduced by up to 72% with less than 10% reduction in accuracy using the provided tables. The tables provide a simple and quick mean to characterize an RLC interconnect which is necessary for performance evaluation in digital circuits.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

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