Diode Connected Transistor-Based Low PDP Adiabatic Full Adder in 7 nm FINFET Technology for MIMO Applications

Author:

Venkatesan A.1,Vanathi P. T.2,Elangovan M.3ORCID

Affiliation:

1. Department of Electronics and Communication Engineering, Kingston Engineering College, Vellore, Tamilnadu, India

2. Department of Electronics and Communication Engineering, PSG College of Technology, Coimbatore, Tamilnadu, India

3. Department of Electronics and Communication Engineering, Government College of Engineering, Srirangam, Trichy, Tamilnadu, India

Abstract

Full adders are a core component and play an essential role in the design of contemporary very-large-scale integration (VLSI) integrated circuits. Low-power, high-speed adder design has been the subject of numerous different sorts of research. The never-ending process is still in progress. The saturation point for MOS-based VLSI circuit design has been reached. As a consequence, many additional issues arise when MOS devices are scaled down to the nanoscale range, including an increase in leakage power and a vulnerability to PVT variation. Hence, MOSFET alternatives have been looked after by VLSI industries. Future nanoscale VLSI circuits would benefit greatly from the use of FINFETs in place of MOS transistors. In this paper, two diode-connected transistors-based low power, high speed, and low-power–delay product (PDP) adiabatic logic full adders are proposed using 7[Formula: see text]nm technology. DCT TSAA-I, DCT TSAA-II, DCT TCAA-I, and DCT TCAA-II are the names of the proposed structures. Power, speed, and power–delay product (PDP) performance of the proposed adders are compared with those of traditional full adders. According to the simulation outcomes, the proposed adder architectures offer the least PDP in comparison to the adders taken into consideration. On power and delay, the impact of changing variables like temperature, supply voltage, load capacitance, and frequency is seen. A 7[Formula: see text]nm FINFET model has been used in the simulations, which were conducted using the Hspice simulation tool.

Publisher

World Scientific Pub Co Pte Ltd

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

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