Unveiling Pyrolysis Mechanisms of Waste Printed Circuit Boards Through Multiphysics Simulation

Abstract

The pyrolysis process of waste printed circuit board (WPCB) with high economic benefit has been a black box problem, limiting the upgrading of pyrolysis processes. The resourcefulness and hazardous nature of WPCB will make it necessary for it to be treated properly. Multiphysics model was built to simulate the whole processes of WPCB pyrolysis and contaminants’ release. The circuit board samples containing six components were selected for pyrolysis in a tube furnace at a rate of 10[Formula: see text]C/min from room temperature to 600[Formula: see text]C, and the residual rate of Br- was determined by the oxygen bomb method. The results showed that the difference in temperature distribution could be attributed to thermal conductivity and surface area. Heat distribution would be more even from the inner material in areas where holes existed. The assembly method would affect the stress distribution around the components. Thermal stress at the pins might cause the separation of components from the substrate. The concentration of brominated contaminants was influenced by the material and assembly method. The instantaneous concentration around the pin was 3–4 times compared to the bare substrate, which was beneficial for the release and control of brominated organics. This study provided the research method for the in-depth understanding of the pyrolysis process of complex materials; and provided a basis for the upgrading of related processes.