CASE STUDY: APPLYING DATA MINING TO DEFECT DIAGNOSIS-Reference-Cited by-同舟云学术

CASE STUDY: APPLYING DATA MINING TO DEFECT DIAGNOSIS

Published:2004-06 Issue:01 Volume:03 Page:69-83
ISSN:0219-6867
Container-title:Journal of Advanced Manufacturing Systems
language:en
Short-container-title:J. Adv. Manuf. Syst.

Author:

JOTHISHANKAR M. C.¹,WU TONG (TERESA)²,ROBERTS JOHNIE³,SHIAU JIUN-YAN⁴

Affiliation:

1. Advanced Manufacturing Technology, Rockwell Collins, Cedar Rapids, IA 52498, USA

2. Department of Industrial Engineering, Arizona State University, PO Box 875906, Tempe, AZ 85287-5906, USA

3. Operations — Quality Assurance, Rockwell Collins, Cedar Rapids, IA 52498, USA

4. Department of Industrial Engineering, Chung Yuan Christian University, Chung-Li, Taiwan 320, ROC

Abstract

One of the defects during the re-flow soldering in printed circuit boards is the defect of tombstone. It is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by several factors. In this paper, a description of the problem is presented with the factors that cause tombstones. Data mining approaches are presented to identify the factors that are significant. Data was collected over a period of one year to study this problem. Results are presented with suggested improvements.

Publisher

World Scientific Pub Co Pte Lt

Subject

Industrial and Manufacturing Engineering,Strategy and Management,Computer Science Applications

Link

https://www.worldscientific.com/doi/pdf/10.1142/S0219686704000405

Reference21 articles.

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