Numerical Prediction and Experimental Verification of Inherent Defect Influences on Frequencies of Adhesively Bonded Joint

Author:

Akkasali Naveen Kumar1ORCID,Biswas Sandhyarani1ORCID,Panda Subrata Kumar1ORCID

Affiliation:

1. Department of Mechanical Engineering, National Institute of Technology, Rourkela 769008, India

Abstract

The vibrational response of adhesively bonded joints with and without defects in the adhesive layer is predicted by simulation for the different overlapping lengths in this work. The eigenvalue extraction method (Block Lanczo’s) is employed within the finite element analysis (FEA) framework to predict the modal values of adhesively bonded joints. The numerical analysis has adopted a solid 20-node quadratic brick elements with reduced integration (C3D20R) to predict the realistic values. The predicted eigenvalues of adhesively bonded joints using an FEA solution are compared with published data and verified the accuracy of the FEA model through experimentation considering defective and non-defective joints. Additionally, simulation solutions are predicted for different overlap lengths (i.e., 25, 30, 35 and 40 mm) by changing the boundary conditions, adhesive bond thickness aspect ratio, adherend thickness ratio, defect position, and defect aspect ratio. The geometries of the adhesive and adherend significantly affect vibration responses through the dampening effect and structural weight, enhancing the stiffness. Defect position and geometry have negligible impact on the natural frequency values for all overlapping lengths except when located around the overlapping edges.

Publisher

World Scientific Pub Co Pte Ltd

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3